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Apple in talks with Indian chipmakers to assemble, package iPhone components: Report
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Apple is in early discussions with Indian chipmakers to assemble and package components for the iPhone, the Economic Times reported on Wednesday, December 17, citing people familiar with the matter.
It is the first time Apple has considered assembling and packaging some chips in India, the ET report said, adding that it is unclear which chips will be packaged at the Sanand facility, though they are likely display chips.
Apple held talks with Murugappa Group-owned CG Semi, which is building an outsourced semiconductor assembly and test (OSAT)…
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