Last week, ASML introduced the Twinscan XT:260 lithography scanner, the industry’s first scanner that has been designed from the ground up for advanced 3D packaging, marking a new era in fab tools.
Advanced packaging technologies like TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) are crucially important to achieve the performance scaling necessary to develop artificial intelligence and to evolve supercomputers.