Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of panel-level packaging (PLP) on glass substrates at SEMICON Japan event this week, reports Nikkei. Panel-level packaging on glass substrates is among the most advanced chip packaging technologies that is set to emerge in the coming years.
The core of Rapidus’s development is 600mm x 600mm glass panels that are used…
