Tech
SiCSem starts work to build country’s first end-to-end chip production project in Odisha
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The integrated facility, expected to be operational by 2027-28, will have a capacity of processing 60,000 SiC wafers annually and packaging about 9.6 crore units.
” Our dream of bringing advanced technology to Odisha is coming true today, and our special focus is on enabling a seamless integration of industry and academia.
“In…
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