TSMC’s CoWoS packaging capacity reportedly stretched due to AI demand — Intel’s EMIB and Foveros eyed as potential solution to bottleneck

TSMC’s dominance in advanced packaging has hit a supply-side wall. With the company’s advanced CoWoS packaging capacity booked out by flagship AI players such as Nvidia, AMD, and Google, second-tier ASIC vendors and major U.S. chipmakers are now exploring Intel’s EMIB and Foveros as alternative back-end options. That includes customers manufacturing logic at TSMC’s Arizona facility, but seeking faster, domestic packaging pathways — something Intel’s Rio Rancho, New Mexico, site is already…